ICSMA 2023

2023 The 6th International Conference on Smart Materials Applications (ICSMA 2023)

Tokyo (Japan), 6-8 January 2023


Key deadlines
Conference starts:
2023-01-06
Paper Submission for Revision by:
2022-11-20
Website

Visit the conference website

Conference Description

Co-organized by South Asia Institute of Science and Engineering (SAISE), Sichuan University, China, Yonsei University, South Korea and Tokyo University of Science, Japan

Conference Proceedings
All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, which is indexed by Scopus.

ICSMA Histories
ICSMA2022 was held online during January 21-24, 2022
ICSMA2021 was held online during January 12-14, 2021
ICSMA2020 was held at Yonsei University, Seoul, South Korea during January 13-16, 2020
ICSMA2019 was held at Tokyo University of Science, Tokyo, Japan during January 19-22, 2019
ICSMA2018 was held at National University of Singapore, Singapore during January 26-28, 2018

Submission Information
Submissioon link: http://confsys.iconf.org/register/icsma2023
Email: icsma@saise.org
Paper template: http://www.icsma.org/TTP_template.doc
Abstract Template: http://www.icsma.org/Abstract-Template.doc
(Abstract means presentation only, only Full paper submission will be published in conference proceedings if accepted.)

Contact Us
Conference Secretary: Ms. Saya Shen
Email: icsma@saise.org
Tel: +852-30717761 (HK) / +86-18062000004 (China)

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