ISDEA 2023

2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023)

Okayama (Japan), 12-14 May 2023


Key deadlines
Conference starts:
2023-05-12
Paper Submission for Revision by:
2023-03-30
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Conference Description

Publication:
All accepted papers in the regular oral presentation / poster will be published in ISDEA 2023 conference proceedings and included into Lecture Notes in Electrical Engineering-Springer book series after review, which is indexed by EI Compendex and Scopus databases.

Agenda Overview:
DAY 1 May 12, 2023
10:00 am--17:00 pm Conference Sign in and Materials Collection

DAY 1 May 13, 2023
09:00 am--19:00 pm Keynote session+technical session

DAY 1 May 14, 2023
09:00 am--19:00 pm Keynote session+technical session

Venue:
Okayama University, Japan
Address: 1丁目-1-1 Tsushimanaka, Kita Ward, Okayama, 700-8530

Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System: http://confsys.iconf.org/submission/isdea2023
Or you could submit your paper by email directly via isdea_conf@163.com

Contact:
Ms. Rachel Cao
Email: isdea_conf@163.com

Conference creator: Vera

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Conference Location

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Okayama (Japan)

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