International conference details
ISDEA 2023
2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023)
Okayama (Japan), 12-14 May 2023
Domain:
Key deadlines
- Conference starts:
- 2023-05-12
- Paper Submission for Revision by:
- 2023-03-30
Website
Conference Description
Publication:
All accepted papers in the regular oral presentation / poster will be published in ISDEA 2023 conference proceedings and included into Lecture Notes in Electrical Engineering-Springer book series after review, which is indexed by EI Compendex and Scopus databases.
Agenda Overview:
DAY 1 May 12, 2023
10:00 am--17:00 pm Conference Sign in and Materials Collection
DAY 1 May 13, 2023
09:00 am--19:00 pm Keynote session+technical session
DAY 1 May 14, 2023
09:00 am--19:00 pm Keynote session+technical session
Venue:
Okayama University, Japan
Address: 1丁目-1-1 Tsushimanaka, Kita Ward, Okayama, 700-8530
Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System: http://confsys.iconf.org/submission/isdea2023
Or you could submit your paper by email directly via isdea_conf@163.com
Contact:
Ms. Rachel Cao
Email: isdea_conf@163.com
Conference creator: Vera
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Conference Location
Okayama (Japan)