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Key deadlines

Conference starts:

2021-05-10

Paper Submission for Revision by:

2021-03-15

Website

Visit the conference website

Conference Description

Full name: IOP--2021 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)--Ei Compendex, SCOPUS
Abbreviation : ICMEE 2021

2021 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka International Convention Center, Osaka, Japan) during (May 10-12, 2021)-

ICMEE 2021 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc

{ History }
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31

{ Submission Method }
1. Send your manuscript directly to conference official email: icmee@outlook.com
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2021

{ Contact }
Ms. Serene Lo
icmee@outlook.com
+86-028-83208181