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Key deadlines

Conference starts:

2019-07-05

Website

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Conference Description

Call for Papers
2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2019)
5-7, July, 2019/Shanghai, China
Web: http://www.icdepi.org/

2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2019) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). sponsored by Dalian University of Technology,Nanyang Technological University and Capitol Technology University. The conference will be held at Dalian, China from July 5-7, 2019!

●Publication Information
1. All accepted and registered papers will be included in IOP Conference Series: Materials Science and Engineering,which will be indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec, and other databases.
2.Selected papers with great extension will be recommended to publish in international journals.

●ICDEPI 2019 Speakers
1.Prof. Ian R. McAndrew,Fellow of the Royal Aeronautical Society,Capitol Technology University, USA
Title: Cybersecurity in the Design and Production Process.
2.Prof. Kai H. Luo,leader of the UK Consortium On Mesoscale Engineering Sciences (UKCOMES),University College London, UK
Title of Speech: Non-Continuum Simulation Methods for Engineering Prediction and Design
3.Prof. Tongming Zhou,The University of Western Australia, Australia
Title of Speech: Vortex structures around multiple circular cylinders arranged in tandem
4.Prof. Qibing Li,Tsinghua University, China
Title of Speech: Turbulence Studies Based on Gas-Kinetic Method
5.Prof. Gopalan Jagadeesh，Indian Institute of Science, India
Title of Speech: Jigsaw Puzzles of Hypersonic Research
6.Prof. Henri Christiaans，Ulsan National Institute of Science & technology (UNIST), South Korea

●Topics(for more topics: http://www.icdepi.org/cfp.html )
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Organization and Management
Product, Service and Systems Design
Design Information and Knowledge
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management
Intelligent Product

●Paper Submission
Submission Email:icdepi@smehk.org
Submission System: https://cmt3.research.microsoft.com/ICDEPI2019

●Call for participants
1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us:icdepi@smehk.org
2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation, you are welcome to join us and share your ideas!
3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to: icdepi@smehk.org

●Contact Us
Ms. Linda Lee
Email: icdepi@smehk.org
Tel:+852-30506862( Hong Kong)
Web: http://www.icdepi.org/