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Key deadlines

Conference starts:

2018-10-26

Website

Visit the conference website

Conference Description

2018 3rd International Conference on Materials Technology and Applications (ICMTA 2018)--EI and SCOPUS
ICMTA 2018
● 2018 3rd International Conference on Materials Technology and Applications (ICMTA2018) will be held during (October 26-29, 2018, Hokkaido, Japan)

● The conference will be held in conjunction with ICNNN 2018 as the workshop, providing great opportunity for ICMTA participants to meet researchers in other related fields as well.

● All registered papers will be published in Materials Science Forum, which will be indexed by Ei, and Scopus. ICMTA 2016 conference proceedings published into MSF (ISBN:978-3-0357-1104-2), and indexed by EI and SCOPUS successfully and ICMTA 2017 conference proceedings will be online soon.

● Please visit "http://icmta.org" for more details

I. Conference Secretary: Ms. Ashily Qi
E-mail:icmta@sciei.us
Tel：+1-562-606-1057 (English Only) /+861-820-7777775 (English&Chinese)

Ⅱ. Submission Methods:
● Full Paper (Presentation and Publication)-Accepted full paper will be invited to give the presentation at the conference and be published in the conference proceedings.
● Abstract (Presentation only)-Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published
★Please log in the Easychair Submission System https://easychair.org/conferences/?conf=ICMTA2018
or send E-mail to icmta@sciei.us .★

Ⅲ. Call for Papers

Conference Scope and Topics are followings (but are not limitted to)

● Advanced Materials’ Characterization

●Advanced Materials’ Manufacturing and Processing

●All classes of materials: metals, ceramics, polymers and composites

●Civil Engineering Applications

●Electronic, Magnetic and Photonic Materials

●Energy Production, Transport and Storage

●Industrial Applications

●Materials for Different Applications

●Mechanics of Materials

●Medical Applications

●Nanomaterials

●Nanotechnologies

●Phase Diagrams Modeling
....