2022 The 5th International Conference on Smart Materials Applications (ICSMA 2022)

About this Conference

Co-organized by South Asia Institute of Science and Engineering (SAISE), Sichuan University, China and Yonsei University, South Korea

★Conference Proceedings
All submissions will be peer reviewed, the registered and presented papers will be published into IOP Conference Series: Materials Science and Engineering, which is indexed by Scopus, Thomson Reuters (WoS), Inspec,et al.

★ICSMA Previous Proceedings
ICSMA 2020 - IOP Conference Series: Materials Science and Engineering Vol. 855| Scopus
ICSMA 2019 - IOP Conference Series: Materials Science and Engineering Vol. 559 | Ei Compendex, Scopus
ICSMA 2018 - IOP Conference Series: Materials Science and Engineering Vol. 422 | Ei Compendex, Scopus

★ICSMA Histories
ICSMA2021 was held online during January 12-14, 2021
ICSMA2020 was held at Yonsei University, Seoul, South Korea during January 13-16, 2020
ICSMA2019 was held at Tokyo University of Science, Tokyo, Japan during January 19-22, 2019
ICSMA2018 was held at National University of Singapore, Singapore during January 26-28, 2018

★Submission Information
Submissioon link: http://confsys.iconf.org/submission/icsma2022
Email: icsma@saise.org
Paper template: http://www.icsma.org/IOP-Template.doc
Abstract Template: http://www.icsma.org/Abstract-Template.doc
(Abstract means presentation only, only Full paper submission will be published in conference proceedings if accepted.)

★Contact Us
Conference Secretary: Ms. Saya Shen
Email: icsma@saise.org
Tel: +852-30717761 (HK) / +86-18062000004 (China)

Important Dates

• Paper November 30, 2021
• Conference dates 8-10 January 2022